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  march 2009 rev 1 1/10 10 HDMIULC6-4F3 4-line ipad?, ultra-large bandwidth esd protection features 4-line 15 kv esd protection ultra low line capacit ance (0.7 pf typ.) ultra-large bandwidth ? no influence on signal rise and fall times ? maximized number of signal harmonics flow-through layout with type c hdmi? connector low pcb space occupation - 1.76 mm2 footprint very low leakage current: 0.1 a max. 0.4 mm pitch wlcsp package to minimize parasitic inductances rohs compliant complies with the standards: iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) application mobile phones hdmi ports at 1.65 gb/s and up to 3.2 gb/s usb 2.0 ports up to 480 mb/s (hi-speed) video line protection tm : ipad is a trademark of stmicroelectronics. hdmi, the hdmi logo and high-definition multimedia interface are trademarks or registered trademarks of hdmi licensing llc. figure 1. pin configuration (bump side) description the HDMIULC6-4F3 is a monolithic, application specific discrete device dedicated to esd protection of the hdmi connection. it also offers the same high level of protection for ieee 1394a and ieee 1394b/c, usb 2.0, ethernet links, and video lines. its ultra high cutoff frequency (7 ghz) secures a high level of signal integrity. the device topology provides this integrity without compromising the complete protection of ics against the most stringent esd strikes. flip chip (top view) 10 bumps d in_ 1+ d in_ 1- d in_ 2+ d in_ 2- d out_ 1+ gnd gnd d out_ 1- d out_ 2+ d out_ 2- 3 21 a d b e c f www.st.com
characteristics HDMIULC6-4F3 2/10 rev 1 1 characteristics figure 2. internal circuit schematic (top view) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2, level 4 air discharge contact discharge 15 15 kv p pp peak pulse power dissipation (8/20 s) 70 w t j maximum junction temperature 125 c t op operating ambient temperature range -30 to + 85 c t stg storage temperature range -55 to + 150 c table 2. electrical characteristics, parameters symbol parameters v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage r d dynamic impedance i pp peak pulse current c line input capacitance per line c i/o - i/o capacitance between i/o c i/o - gnd capacitance between i/o and gnd i v i f v f i rm i r i pp v rm v br v cl slope = 1/r d
HDMIULC6-4F3 characteristics rev 1 3/10 table 3. electrical characteristics, values (t amb = 25 c) symbol test condition min typ max unit v br i r = 1 ma 6 9 v i rm v rm = 3 v 3 100 na c i/o-gnd (1) 1. c i/o-gnd values are given per line and relative to one gnd. v line = 0 v, v osc = 30 mv, f = 1 mhz 1.3 pf v line = 0 v, v osc = 30 mv, f = 825 mhz 0.7 0.9 pf c i/o-gnd (1) v line = 0 v, v osc = 30 mv, f = 1 mhz between two lines of the same lane 0.06 pf c i/o-i/o v line = 0 v, v osc = 30 mv, f = 1 mhz 0.9 pf v line = 0 v, v osc = 30 mv, f = 825 mhz 0.55 0.65 pf c i/o-i/o v line = 0 v, v osc = 30 mv, f = 1 mhz 0.05 pf bw bandwidth at -3 db 7 ghz figure 3. s21 versus frequency figure 4. analog crosstalk measurements 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g -4.00 -3.00 -2.00 -1.00 0.00 i1-o1 i2-o2 i3-o3 i4-o4 f (hz) db 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g -120.00 -90.00 -60.00 -30.00 0.00 i2-o1 i4-o1 f (hz) db figure 5. digital crosstalk measurements i1 - o2 figure 6. digital crosstalk measurements i2 - o3 500 mv/div 50 mv/div 5.0 ns/div in out 5.0 ns/div in out 500 mv/div 40 mv/div
characteristics HDMIULC6-4F3 4/10 rev 1 figure 7. step response attenuation i1 - o1 figure 8. step response attenuation i2 - o2 500 mv/div 500 mv/div 5.0 ns/div in out 500 mv/div 500 mv/div in out 5.0 ns/div figure 9. esd response to iec 61000-4-2 (+8 kv contact discharge) on i1 - o1 figure 10. eesd response to iec 61000-4-2 (-8 kv contact discharge) on i1 - o1 20 v/div 138.4 v 16.8 v 9.4 v 20 ns/div v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl 1 1 2 2 3 3 10 v/div -64.2 v -4.3 v -2.3 v 20 ns/div v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl 1 1 2 2 3 3 figure 11. esd response to iec 61000-4-2 (+8 kv contact discharge) on i2 - o2 figure 12. esd response to iec 61000-4-2 (-8 kv contact discharge) on i2 - o2 20 v/div v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl 1 2 3 138 v 17.4 v 12.9 v 20 ns/div 1 2 3 10 v/div -62.6 v -4.5 v -1.2 v 20 ns/div v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl 1 1 2 2 3 3
HDMIULC6-4F3 characteristics rev 1 5/10 figure 15. line to ground capacitance versus frequency, v line = 0 v, v osc = 30 mv figure 13. esd response to iec 61000-4-2 (+8 kv contact discharge) on i3 - o3 figure 14. esd response to iec 61000-4-2 (-8 kv contact discharge) on i3 - o3 20 v/div v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl 1 2 3 141 v 17.5 v 14.7 v 20 ns/div 1 2 3 10 v/div -61.5 v -2.9 v -2.5 v 20 ns/div v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl 1 1 2 2 3 3 0 200 400 600 800 1000 1200 1400 1600 1 10 100 1000 10000 c(ff) f(mhz)
typical application schematic HDMIULC6-4F3 6/10 rev 1 2 typical application schematic figure 16. implementation with hdmi type c connector (mobile phone) (tv, flat panel, monitor, projector) multimedia controller multimedia controller gnd tx2+ tx1- gnd tx1+ tx0- gnd tx0+ tc- gnd tc+ cec scl sda hpd gnd tx2+ tx1- gnd tx1+ tx0- gnd tx0+ tc- gnd tc+ cec scl sda hpd video audio ctrl / status video audio ctrl / status v dd _5v v dd _5v type c connector pin - out type c connector pin - out hdmiulc6 - 4f3 hdmi05 - cl02f3 host (mobile phone) display (tv, flat panel, monitor, projector) multimedia controller multimedia controller gnd tx2+ tx1- gnd tx1+ tx0- gnd tx0+ tc - gnd tc+ cec scl sda hpd gnd tx2+ tx1- gnd tx1+ tx0- gnd tx0+ tc - gnd tc+ cec scl sda hpd video audio ctrl / status video audio ctrl / status v dd _5v v dd _5v type c connector pin - out type c connector pin - out hdmiulc6 - 4f3 hdmi05 - cl02f3 5v hpd HDMIULC6-4F3 b2 d3 d1 c3 c1 a1 a3 f1 f3 100k 4 tmds channel hdmi05-cl02f3 cec 5v scl 2 x 1k75 sda tmds data2 shield tmds data1 shield tmds data0 shield tmds clk shield tmds data2 + tmds data2 - tmds data1 + tmds data1 - tmds data0 + tmds data0 - tmds clk + tmds clk - ddc / eec ground cec scl sda reserved +5v power hot plug detect j4 1 2 3 4 5 7 8 9 10 11 12 13 14 16 17 18 19 6 15 27k vdd_cec e2 HDMIULC6-4F3 d3 d1 c3 c1 a1 a3 f1 f3 b2 e2 5v hpd HDMIULC6-4F3 b2 d3 d1 c3 c1 a1 a3 f1 f3 100k 4 tmds channel hdmi05-cl02f3 cec 5v scl 2 x 1k75 sda tmds data2 shield tmds data1 shield tmds data0 shield tmds clk shield tmds data2 + tmds data2 - tmds data1 + tmds data1 - tmds data0 + tmds data0 - tmds clk + tmds clk - ddc / eec ground cec scl sda reserved +5v power hot plug detect j4 1 2 3 4 5 7 8 9 10 11 12 13 14 16 17 18 19 6 15 27k vdd_cec e2 HDMIULC6-4F3 d3 d1 c3 c1 a1 a3 f1 f3 d3 d1 c3 c1 a1 a3 f1 f3 b2 e2 b2 e2 hdmi tx2- tx2- gnd gnd
HDMIULC6-4F3 layout recommendations rev 1 7/10 3 layout recommendations figure 17. layout recommendations 4 ordering information scheme figure 18. ordering information scheme pcb routing: ?tmds routing on layer 3 ?gnd plane on layers 1 and 5 ?opening on layers 2 and 4 or ?everything on top layer ? opening on layer 2 and gnd on layer 3. hdmi type c connector hdmi ulc - 6 4 f3 application ultra-low capacitance breakdown voltage number of lines package hdmi = hdmi type protection 6 = 6 volts minimum 4 = 4 lines f3 = fli p chi p , 0.4 mm p itch
package information HDMIULC6-4F3 8/10 rev 1 5 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 19. flip chip dimensions 4 00 m 1.6 mm 40 1.1 mm 40 400 m 200 m 255 m 605 m 55 figure 20. footprint recommendations figure 21. marking 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot, st logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) ecopack ? grade
HDMIULC6-4F3 ordering information rev 1 9/10 figure 22. flip chip tape and reel specification 6 ordering information table 4. ordering information 7 revision history table 5. document revision history user direction of unreeling all dimensions in mm 4.0 0.1 8.0 0.3 4.0 0.1 1.75 0.1 3.5 - 0.1 ? 1.5 0.1 0.69 0.05 1.21 0.05 1.67 0.05 st e xxz yww st e xxz yww st e xxz yww dot identifying pin a1 location order code marking package weight base qty delivery mode HDMIULC6-4F3 ep flip chip 2.6 mg 5000 tape and reel (7?) date revision changes 24-mar-2009 1 first issue.
HDMIULC6-4F3 10/10 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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